A new comprehensive wide-band compact modeling methodology for single-ended spiral inductors and differential spiral inductors is presented. The new modeling methodology creates an equivalent circuit model consisting o ...

A computationally efficient and accurate substrate noise coupling model for multiple contacts in heavily doped CMOS processes is presented and validated with simulations and experimental data. The model is based on Z par ...

The substrate noise injected by a stepped buffer circuit into two single-ended 1.5GHz low noise amplifiers is examined for a heavily doped 0.25µm CMOS process. The difference in the LNA noise rejection is characterized a ...

Plastic packaging is a cost-effective solution for housing RF and microwave integrated circuits in low cost communication devices. While enabling low cost packaging of integrated circuits, plastic packages including the ...

The primary objective of the thesis research is to study novel schemes of on-chip crosstalk suppression employing magnetic films at microwave frequencies. Since extraction of various material properties of the magnetic f ...

The focus of this work is on the steady-state analysis of RE circuits using a coupled device and circuit simulator. Efficient coupling algorithms for both the time-domain shooting method and the frequency-domain harmon ...