A new adhesive bonding method is introduced for microlamination architectures, for producing low-temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been ...
Paulraj, Prawin; Paul, Brian K.; Peterson, Richard B.(Elsevier, 2012-12-15)
A low-temperature liquid-to-vapor counterflow microchannel heat exchanger has been redesigned and fabricated using a scalable, low-cost adhesive bonding process. Adhesive erosion concerns are mitigated with the use of se ...
