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Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers

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dc.creator Prawin, Paulraj
dc.creator Paul, Brian K.
dc.date.accessioned 2011-03-15T16:24:59Z
dc.date.available 2011-03-15T16:24:59Z
dc.date.issued 2011-02-23
dc.identifier.citation Prawin, P., & Paul, B. K. (2011, February 23). Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers. Journal of Manufacturing Processes. doi:10.1016/j.jmapro.2011.01.001 en_US
dc.identifier.uri http://hdl.handle.net/1957/20495
dc.description This is the authors’ post-peer review version of the final article. The final published version can be found at: http://www.elsevier.com/wps/find/journaldescription.cws_home/620379/description#description. en_US
dc.description.abstract This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate channel laminae, resulting in approximately 50% material savings over traditional methods. An assembly process using adhesive dispense and cure is outlined to produce leak-free devices. Optimal fill ratios were determined to be between 1.1 and 1.25. Bond strength investigation reveals robustness to surface conditions and a bond strength of 5.5-8.5 MPa using a 3X safety factor. Dimensional characterization reveals a two sigma (95%) post-bonded channel height tolerance under 10% after bonding. Patterning tolerance and surface roughness of the laminae faying surfaces were found to have a significant influence on the final post-bonded channel height. Leakage and burst pressure testing on several samples has established confidence that adhesive bonding can produce leak-free joints. Operating pressures up to 413 kPa have been satisfied equating to tensile pressure on bond joints of 1.9 MPa. Higher operating pressures can be accommodated by increasing the bond area of devices. en_US
dc.language.iso en_US en_US
dc.publisher Elsevier en_US
dc.relation.ispartofseries Journal of Manufacturing Processes en_US
dc.relation.ispartofseries 2011 en_US
dc.subject Adhesive bonding en_US
dc.subject Microchannel array en_US
dc.subject Microlamination en_US
dc.subject Low temperature heat exchanger en_US
dc.title Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers en_US
dc.type Article en_US
dc.description.peerreview yes en_US
dc.identifier.doi 10.1016/j.jmapro.2011.01.001


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