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Application of controlled thermal expansion in diffusion bonding for the high-volume microlamination of MECS devices

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Application of controlled thermal expansion in diffusion bonding for the high-volume microlamination of MECS devices

Pluess, Christoph
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Name: PluessChristoph2005.pdf
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Description: Application of controlled thermal expansion in diffusion bonding for the high-volume microlamination of MECS devices.pdf
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URI: http://hdl.handle.net/1957/30100
Date: 2004-09-10

Description:

Graduation date: 2005
Advisor: Paul, Brian K.
Subject: Microfluidic devices
Microfluidics
Diffusion bonding (Metals)
Microlamination

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