Article
 

Development of an adhesive-bonded counterflow microchannel heat exchanger

Public Deposited

Downloadable Content

Download PDF
https://ir.library.oregonstate.edu/concern/articles/5m60qs58t

Descriptions

Attribute NameValues
Creator
Abstract
  • A low-temperature liquid-to-vapor counterflow microchannel heat exchanger has been redesigned and fabricated using a scalable, low-cost adhesive bonding process. Adhesive erosion concerns are mitigated with the use of sealing bosses. Performance has been tested using water and compressed air as test fluids. Results show greater effectiveness and higher heat transfer rates than the original heat exchanger due to relaxed design constraints afforded with adhesive bonding. A maximum effectiveness of 82.5% was achieved with good agreement between theoretical and experimental values. Although thermal performance was improved, higher pressure drops were noted. Pressure drops were predicted with a maximum error of 16% between theoretical and experimental values. Much of the pressure drop was found to be in the device manifold which can be improved in subsequent designs.
  • Keywords: pressure drop, counterflow heat exchanger, adhesive bonding, microchannel array, effectiveness
Resource Type
DOI
Date Available
Date Issued
Citation
  • Paulraj, P., Paul, B., & Peterson, R. (2012). Development of an adhesive-bonded counterflow microchannel heat exchanger. Applied Thermal Engineering, 48, 194-201. doi: 10.1016/j.applthermaleng.2012.05.001
Journal Title
Journal Volume
  • 48
Rights Statement
Publisher
Peer Reviewed
Language
Replaces

Relationships

Parents:

This work has no parents.

Items

Thumbnail Title Date Uploaded Visibility Actions
file details PaulBrianMechanicalIndustrialManufacturingEngineeringDevelopmentAdhesiveBonded.pdf 2017-07-08 Public Download