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A test fixture and deembedding procedure for high-frequency substrate characterization

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dc.contributor.advisor Fiez, Terri en
dc.contributor.advisor Mayaram, Kartikeya en
dc.creator Webb, Kyle M. en
dc.date.accessioned 2005-09-06T20:22:51Z
dc.date.available 2005-09-06T20:22:51Z
dc.date.copyright 2005-06-27
dc.date.issued 2005-06-27
dc.identifier.uri http://hdl.handle.net/1957/425
dc.description Graduation date: 2006
dc.description Advisors: Terri Fiez, Karti Mayaram. Committee members: Andreas Weisshaar, David Hackleman.
dc.description.abstract At frequencies exceeding 1-2 GHz, the substrate network models used in substrate coupling simulation must account for the reactive nature of the substrate. Unlike at low frequencies, where the purely resistive substrate models can be validated through DC resistance measurements, these high-frequency models, comprising reactive components, must be validated through high-frequency network analyzer measurements. Accurately obtaining such measurements requires careful design of both a measurement test fixture as well as a measurement deembedding procedure. A test fixture has been fabricated and a deembedding procedure designed to enable high-frequency (up to 20 GHz) network parameter measurements of a silicon substrate. A test chip, containing a variety of substrate test structures has been fabricated in a 0.35 μm CMOS process on a heavily-doped substrate. The design of the test fixture, test chip, and deembedding procedure has been validated through extensive simulations in HFSS. Measurements have been made on the test chips mounted in the test fixture. The performance of the test fixture and measurement deembedding procedure has been evaluated, and suggestions for future improvements in this area are presented. en
dc.format.extent 1364410 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US en
dc.subject Substrate coupling en
dc.subject Substrate characterization en
dc.subject.lcsh Mixed signal circuits -- Noise
dc.subject.lcsh Electronic noise
dc.title A test fixture and deembedding procedure for high-frequency substrate characterization en
dc.type Thesis en
dc.degree.name Master of Science (MS) in Electrical and Computer Engineering en
dc.degree.level Master's en
dc.degree.discipline Engineering en
dc.degree.grantor Oregon State University en
dc.contributor.committeemember Weisshaar, Andreas en
dc.contributor.committeemember Hackleman, David en

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