Strategies for simulation and measurement of substrate noise have been analyzed using various digital and analog circuits fabricated in the TSMC 0.35um heavily doped CMOS process. The measurements validate a substrate noise coupling macromodel that has been used to obtain the simulation results. The simulations and measurements also substantiate the...
This thesis presents a low power DC-DC converter suitable for harvesting energy from high impedance thermoelectric generators (TEGs) for the use in body powered electronics. The chip has been fabricated in a 130nm CMOS technology. To meet the power demands of body powered networks, a novel dual-path architecture capable of...
The design of mobile wireless devices has always focused on reducing power, area, and cost. This dissertation proposes two techniques that are leveraged to save power and area and therefore cost. The first techniques reduces the noise in the receiver and results in a relaxed power requirement. The second technique...
A methodology for rapid estimation of substrate noise generated by digital circuitry in mixed-signal circuits is presented. This methodology is incorporated into the Silencer! framework, and also provides for future improvements including pre-layout noise estimation. Measurements of a test chip fabricated in the TSMC o.25[mu]m heavily doped logic process validate...
An analysis of substrate noise coupling in mixed-signal circuits has been performed in the TSMC 0.25 [mu]m lightly doped and heavily doped CMOS processes. Methods to minimize noise coupling in both the chip design and board design phases are presented along with techniques for accurate circuit simulation of noise coupling....
This thesis presents an automated methodology to calibrate the substrate profile for accurate prediction of substrate parasitics using Green's function based extractors. The technique requires fabrication of only a few test structures and results in an accurate three layered approximation of a heavily doped epitaxial silicon substrate. The obtained substrate...
This thesis examines substrate noise coupling for NMOS transistors in heavily doped substrates. The study begins with the analysis of an NMOS transistor switching noise in a digital inverter at the device level. A resistive substrate network for the NMOS transistor is proposed and verified. Coupling between N+- P+ contacts...
This thesis presents Silencer!, a fully automated, schematic-driven tool for substrate noise coupling simulation and analysis. It has been integrated in the CADENCE DFII environment and seamlessly enables substrate coupling analysis in a standard mixed-signal design flow. Silencer! aids IC designers in the analysis of substrate noise coupling at different...
Delay insensitive asynchronous circuitry provides significant advantages with
respect to substrate noise due to localized switching. The differences between the
substrate noise from NULL Convention Logic (NCL) and traditional Clocked
Boolean Logic (CBL) are described and analyzed based on measured results. A test chip fabricated in the TSMC 0.25 um...