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Filtering by: Subject Electric motors -- Design and construction Remove constraint Subject: Electric motors -- Design and construction Contributor advisor sim Weisshaar, Andreas Remove constraint Contributor advisor sim: Weisshaar, Andreas

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  • Metal fill considerations for on-chip interconnects and spiral inductors

    Creator:
    Shilimkar, Vikas S.
    Abstract:
    Variability in circuit performance due to process defects is a major concern in integrated circuit (IC) fabrication. Advanced IC manufacturing processes employ Chemical-Mechanical Polishing (CMP) for planarization of oxide and metal layers. CMP defects result in variations in the oxide and metal topographical profile. To reduce these topographical variations, electrically...
    Resource Type:
    Masters Thesis
    Full Text:
    Design Parameters . . . . . . . . . . . . . . . . . . 70 4.4 Separation of Electric and Magnetic Impact

  • Inductors in high-performance silicon radio frequency integrated circuits : analysis, modeling, and design considerations

    Creator:
    Lutz, Richard D., Jr
    Abstract:
    Spiral inductors are a key component of mixed-signal and analog integrated circuits (IC's). Such circuits are often fabricated using silicon-based technology, owing to the inherent low-cost and high volume production aspects. However, semiconducting substrate materials such as silicon can have adverse effects on spiral inductor performance due to the lossy...
    Resource Type:
    Dissertation
    Full Text:
    : Inductors in High-Performance Silicon Radio Frequency Integrated Circuits: Analysis, Modeling, and Design

  • Electrical recommendations and formulas for metal fill in radio-frequency integrated circuits

    Creator:
    Gaskill, Steven
    Abstract:
    With increasing transistor operating frequencies, interconnects and passive devices are becoming performance limiters in integrated circuit (IC) designs. To combat this, the interconnect layers above the active silicon are trending toward low-κ dielectrics and Cu metallization. The use of these new materials has popularized chemical mechanical polishing (CMP) to planarize...
    Resource Type:
    Masters Thesis
    Full Text:
    . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2 Simulation-Based Analysis and Design Recommendations 11 2.1 Metal Fill Impact on MIM Capacitor

  • A base control Doherty power amplifier design for improved efficiency in GSM handsets

    Creator:
    Ferwalt, Darren W.
    Abstract:
    In cellular telephones, RF power amplifiers consume a significant part of the total phone current. Reducing the average PA current will extend battery life. In GSM systems the handset is commanded by the base station to transmit at power levels lower than full power much of the time. A Doherty...
    Resource Type:
    Masters Thesis
    Full Text:
    , and only lumped element matches are used. Each amplifier is a two-stage design to provide enough

  • Enabling metal-fill-aware design of integrated circuits

    Creator:
    Shilimkar, Vikas S.
    Abstract:
    In advanced integrated circuit (IC) processes, the metal fill inserted to meet foundry imposed density requirements degrades the performance of interconnects and passive components which ultimately affects the overall circuit performance. Accounting for this degradation through electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However,...
    Resource Type:
    Dissertation
    Full Text:
    electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However