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Filtering by: Creator Repukaiti, Reyixiati Remove constraint Creator: Repukaiti, Reyixiati Committee Member Lee, Tae-Kyu Remove constraint Committee Member: Lee, Tae-Kyu

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  • The Effect of Surface Finish on Ball Grid Array Lead Free Solder Joints

    Creator:
    Casali, Dick R.
    Abstract:
    As microelectronic parts trend smaller so do their solder joints. The surface finish on a copper pad is expected to become a significant part of the total solder joint volume and therefore affect mechanical properties of the smaller solder joints. Two sample geometries and four different surface finishes for tin-silver-copper...
    Resource Type:
    Dissertation
    Full Text:
    for Al coatings. Dr. Qin Yu for EBSD consultations. Cody P. Fast, “Richard” Reyixiati Repukaiti