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Filtering by: Advisor Tripathi, Vijai K. Creator Jong, Jyh Ming

Time domain characterization of interconnect discontinuities

Creator:

Jong, Jyh-Ming

Abstract:

The purpose of this study is to develop experimental techniques to characterize typical interconnect discontinuities, including bends, steps, T junctions, vias and pads, which are the most commonly encountered interconnections in high speed digital integrated circuits, hybrid and monolithic microwave circuits and electronic packages. The time domain reflection response of...

Resource Type:

Masters Thesis

Full Text:

. Vijai K. Tripathi for his guidance and great help throughout my master's years. I would also like to
Electrical characterization and circuit modeling of interconnections and packages for high speed circuits by time domain measurements

Creator:

Jong, Jyh-ming

Abstract:

With edge rates of high speed digital devices pushing into the sub-nano second range, interconnections with the associated packages play a major role in determining the speed, size and performance of digital circuits and systems. The purpose of this study is to develop experimental techniques based on time domain peeling...

Resource Type:

Dissertation