Current trends in integrated circuit technology are continuing towards physically smaller components and related structures. Interconnects between circuit components have reached sub-micron dimensions which can not be modeled accurately by the current ideal microstrip analysis based techniques. These techniques often assume that the structure being modeled is perfectly conducting, smooth,...
A new second order accurate nonuniform grid spacing technique which does not
depend on supraconvergence is developed for Finite Difference Time Domain (FDTD)
simulation of general three dimensional structures. The technique is useful for FDTD
simulations of systems which require finer details in small regions of the simulation space by...