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Filtering by: Creator Luoh, Yi Remove constraint Creator: Luoh, Yi Language English [eng] Remove constraint Language: English [eng]

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  • Analysis and modeling of coplanar on-chip interconnects on silicon substrates

    Creator:
    Luoh, Yi
    Abstract:
    The electrical behavior of on-chip interconnects has become a dominant factor in silicon-based high speed, RF, and mixed-signal integrated circuits. In particular, the frequency-dependent loss mechanisms in heavily-doped silicon substrates can have a large influence on the transmission characteristics of on-chip interconnects. To optimize the performance of the integrated circuit,...
    Resource Type:
    Masters Thesis
    Full Text:
    AN ABSTRACT OF THE THESIS OF Yi(Amy) Luoh for the degree of

  • Analysis and modeling of microstrip on-chip interconnects on silicon substrate

    Creator:
    Lan, Hai
    Abstract:
    The electrical performance of on-chip interconnects has become a limiting factor to the performance of modern integrated circuits including RFICs, mixed-signal circuits, as well as high-speed VLSI circuits due to increasing operating frequencies, chip areas, and integration densities. It is advantageous to have fast and accurate closed-form expressions for the...
    Resource Type:
    Masters Thesis
    Full Text:
    , Chi-Young Lim, Daniel Melendy, Richard Lutz, Sorwar Hossain, and Amy Luoh, for their encouragement

  • Analysis and modeling of monolithic on-chip transformers on silicon substrates

    Creator:
    Mayevskiy, Yevgeniy
    Abstract:
    Passive components, including spiral inductors and transformers, fabricated on silicon-based substrates are placing an increasing demand on radio-frequency integrated circuit (RFIC) design. Performance of the RFIC suffers from several non-ideal effects that must be taken into account in order to create a successful design. In particular, monolithic transformers can be...
    Resource Type:
    Masters Thesis
    Full Text:
    Luoh, Rajarajan Senguttuvan, and Sarwar Hossain, for their encouragement, useful discussions

  • Analysis and modeling of substrate noise coupling for NMOS transistors in heavily doped substrates

    Creator:
    Hsu, Shu-ching
    Abstract:
    This thesis examines substrate noise coupling for NMOS transistors in heavily doped substrates. The study begins with the analysis of an NMOS transistor switching noise in a digital inverter at the device level. A resistive substrate network for the NMOS transistor is proposed and verified. Coupling between N+- P+ contacts...
    Resource Type:
    Masters Thesis
    Full Text:
    for reviewing my thesis. I am thankful for Husni Habal and Amy Luoh for their friendship and support

  • Modelling of on-chip spiral inductors for silicon RFICs

    Creator:
    Melendy, Daniel
    Abstract:
    In high-frequency circuit design, performance is often limited by the quality of the passive components available for a particular process. Specifically, spiral inductors can be a major bottle-neck for Voltage-Controlled Oscillators (VCOs), Low-Noise Amplifiers (LNAs), mixers, etc. For designers to correctly optimize a circuit using a spiral inductor, several frequency-domain...
    Resource Type:
    Masters Thesis
    Full Text:
    suggestions. Thanks to my colleagues, Amy Luoh, Hai Lan, and Ji Zheng, for their encour- agement, useful

  • Broadband modeling of on-chip transformers for silicon RFICs

    Creator:
    Rapolu, Kavitha
    Abstract:
    Magnetically coupled passive transformers are increasingly integrated on-chip for various analog and radio frequency (RF) applications including direct current (DC) isolation, impedance transformation/matching, and conversion between single-ended and differential signals. A primary motivation for the on-chip integration of transformers is the overall size reduction and reduced cost. However, the performance...
    Resource Type:
    Masters Thesis

  • Modeling and Design of Interconnects and Passive Components for Millimeter-Wave Integrated Circuits in Silicon

    Creator:
    Zheng, Lei
    Abstract:
    For mmWave Integrated Circuit (IC) design, co-integration of passives can reduce size and power consumption, increase reliability, and reduce overall cost. However, skin and proximity effects in the metallization are aggravated at mmWave frequencies, resulting in increased attenuation and degradation of overall performance. Furthermore, tight integration of passive components (to...
    Resource Type:
    Dissertation

  • Radiation effects in III-V compound semiconductor heterostructure devices

    Creator:
    Li, ChyiShiun
    Abstract:
    The radiation effects in III-V heterojunction devices are investigated in this thesis. Two types of heterojunction devices studied are InGaP/GaAs single heterojunction bipolar transistors (SHBTs) and GaN-based heterojunction light emitting diodes (LEDs). InGaP/GaAS HBTs are investigated for high energy (67 and 105 MeV) proton irradiation effects while GaN heterojunction LEDs...
    Resource Type:
    Masters Thesis
    Full Text:
    wife, Amy Yi-Hong Luoh, for her love, support and encouragement through my graduate studies. A

  • Enabling metal-fill-aware design of integrated circuits

    Creator:
    Shilimkar, Vikas S.
    Abstract:
    In advanced integrated circuit (IC) processes, the metal fill inserted to meet foundry imposed density requirements degrades the performance of interconnects and passive components which ultimately affects the overall circuit performance. Accounting for this degradation through electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However,...
    Resource Type:
    Dissertation