The advancement of new manufacturing techniques such as additive manufacturing enable significantly greater freedom of design compared to conventional techniques. Of significant interest is what improvements could be made in the design of cold plates and heat sinks for electronics cooling. Greater design freedom could potentially enable new designs that...
The ever increasing requirements for heat dissipation in various thermal management applications such as computer chip cooling and high power electronics have necessitated the need for novel thermal management techniques. Thermal management using heat sinks with microscale features is amongst the prominent techniques developed over the past two decades. In...
Liquid cooled, laminar microchannel heat sinks were
earlier proposed by Tuckerman for cooling high heat
generating integrated circuits and high power microwave
generation systems using photoconductive switches. A
method of computationally analyzing the heat sinks is
presented which produces the desired temperature and
velocity distributions within the heat sinks. The...
This objective of this study is to investigate the capability of nanostructured surfaces on dissipating heat flux by performing pool boiling and convective flow boiling. The generation of ultra-high heat flux from high performance electric devices has motivated a number of investigations related to advanced heat transfer especially in two-phase...
The pressure drop of convective boiling flow may be reduced by extracting vapor locally since the entire generated vapor does not have to travel through the entire channel length. In this study, the theoretical model was developed to simulate a convective boiling flow through a fractal-like branching microchannel network with...
This research work focuses on the mechanism of 1/f noise in GaAs
resistors on semi-insulating substrates and 1/f noise due to temperature
fluctuations in heat conduction in resistors, diodes, and bipolar transistors. The
goal of this research is to generate accurate models to explain physical origin of 1/f
noise in...
A non-intrusive measurement technique for direct quantitative thermal visualization of channel wall temperatures in two phase microchannel flows using infrared thermography (IRT) is presented. Specifically, the measurement of top channel wall temperatures in a fractal-like branching microchannel silicon heat sink during flow boiling is demonstrated and thoroughly documented. Obtaining quantitative...
It is hypothesized that increases in pressure drop due to vapor generation during boiling in microchannels can be reduced by extraction of vapor at its point of inception. Ultimately, this local vapor extraction decreases the pressure drop required to drive the flow through a fractal-like branching, microchannel flow network within...
With the miniaturization of microelectronics and increase of processor speeds in the last few decades, thermal management is drastically affecting overall packaging and system capabilities. Due to the special needs introduced, research focusing on microscale cooling has increased. This study combines the positive characteristics of single- and two-phase flows in...