The advent of low-cost RFIC's fabricated in Silicon-based technologies has led to the use of monolithic lumped elements which are located on-die. While it is clearly advantageous to have a high degree of integration and thus fewer off chip elements, parasitic losses due to semiconducting substrate effects can be a...
With increasing operating frequencies in CMOS RF/microwave integrated circuits,
the performance of on-chip interconnects is becoming significantly affected by the lossy
substrate. It is the purpose of the first part of this thesis to develop a rigorous field
theoretic analysis approach for efficient characterization of single and multiple coupled
interconnects...