As the drive continues to reduce the size of Printed Wiring Assemblies (PWAs),
improve performance of electronic assemblies, and reduce costs of these products,
reliable secondary (bottom) side reflow operations must be developed. Attaching Surface
Mount Technology (SMT) components to the secondary side of a Printed Circuit Board
(PCB) is...
The purpose of this research is to develop an approach to minimize makespan for assigning boards to production lines. Because of sequence-dependent setup issue, board assignment and component allocation have to be performed concurrently. An integrated methodology is proposed to obtain a solution of the two problems. The methodology consists...
A new comprehensive wide-band compact modeling methodology for single-ended spiral inductors and differential spiral inductors is presented. The new modeling methodology creates an equivalent circuit model consisting of frequency-independent circuit elements for use in circuit simulators. A fast automated extraction procedure is developed for determining the circuit element values from...
Multi-Gigahertz sampling rate Analog-to-Digital Converters (ADC) with 5-8 bits resolution are used in many signal communication applications. Unfortunately, the performance of the high speed ADC is limited by the timing accuracy of the sampling clock. A small sampling uncertainty can cause a large error in the sampled voltage and result...
Present day data processing technology requires very high speed signal processing
and data conversion rates. Traditionally, these circuits have been implemented in silicon
MOS technology, whose high speed performance is limited, due to inherent material properties.
Though relatively immature compared to silicon technology, GaAs integrated circuit
technology appears to be...
Power optimization becomes more and more important due to the design cost and reliability. Sometimes high power consumption means expensive package cost and low reliability. The first step in optimizing power consumption is determining where power is consumed within a processor. While system-level code tracing and bit transition calculation are...
Variability in circuit performance due to process defects is a major concern in integrated circuit (IC) fabrication. Advanced IC manufacturing processes employ Chemical-Mechanical Polishing (CMP) for planarization of oxide and metal layers. CMP defects result in variations in the oxide and metal topographical profile. To reduce these topographical variations, electrically...
Real world is analog but the processing of signals can best be done in digital domain. So the need for Analog to Digital Converters(ADCs) is ever rising as more and more applications set in. With the advent of mobile technology, power in electronic equipment is being driven down to get...
Harvesting energy from the environment for powering micro-power devices have been increasing in popularity. These types of devices can be used in embedded applications or in sensor networks where battery replacement is impractical. In this dissertation, different methods of energy harvesting from the environment are explored as alternative sources of...
A digital phase locked loop (DPLL) and a statistical time-to-digital converter (STDC) were previously fabricated in a 0.35µm, 3.3V SOI CMOS process. This work summarizes these designs and characterizes the measured performance. Simulations supplement the measurements where applicable.
The DPLL was found to reach a locked state under a limited...