With increasing operating frequencies in CMOS RF/microwave integrated circuits,
the performance of on-chip interconnects is becoming significantly affected by the lossy
substrate. It is the purpose of the first part of this thesis to develop a rigorous field
theoretic analysis approach for efficient characterization of single and multiple coupled
interconnects...
In this thesis the network analog method is used to analyze various planar multi-conductor structures in multilayered, lossy dielectric media. The method is based on an efficient impedance network representation of the finite difference approximation of Laplace's equation for the electric potential. Using the network analog method, the transmission line...
A new CAD-oriented methodology for the full-wave broadband characterization of coupled microstrip structures for RF/microwave and high-speed digital circuits is presented. The characterization methodology is based on the finite difference time domain (FDTD) technique combined with a systematic extraction procedure using the normal mode approach and multiport network concepts. The...
Recent developments in digital communications at microwave frequencies have revealed that local oscillator phase noise is often a factor in the bit error rate (BER) analysis. Digital signals transported across microwave radio links acquire waveform jitter from local oscillator phase noise. As jitter increases so does BER.
The main goals...
A method and apparatus are presented for generating suppressed carrier digital clock signals. These clock signals have the advantage of being broad band in nature and thus exhibiting lower power spectral density. Structures or systems utilizing such clock signals would be less likely to create electromagnetic noise of sufficient intensity...
The advent of low-cost RFIC's fabricated in Silicon-based technologies has led to the use of monolithic lumped elements which are located on-die. While it is clearly advantageous to have a high degree of integration and thus fewer off chip elements, parasitic losses due to semiconducting substrate effects can be a...
Recent advances in high density low cost RF and microwave three dimensional
integration technologies using LTCC(Low Temperature Cofired Ceramics),
laminate and other multilayer hybrid and integrated circuits have increased interest
in the design of embedded passive components such as inductors, capacitors and
filters. The purpose of this study is to...
A new second order accurate nonuniform grid spacing technique which does not
depend on supraconvergence is developed for Finite Difference Time Domain (FDTD)
simulation of general three dimensional structures. The technique is useful for FDTD
simulations of systems which require finer details in small regions of the simulation space by...
With edge rates of high speed digital devices pushing into the sub-nano second
range, interconnections with the associated packages play a major role in determining
the speed, size and performance of digital circuits and systems. The purpose of this
study is to develop experimental techniques based on time domain peeling...