Index Catalog // ScholarsArchive@OSU

Paleoseismic Record of Peninsula Segment Earthquakes on the San Andreas Fault near San Francisco, CA and possible NSAF linkage to Cascadia

Creator:: Goldfinger, Chris
Abstract:: Lake Merced results have established the lake as a viable paleoseismic site on the northern San Francisco peninsula. The lake records ~ 2300 years of event beds, 17 in total. Prior to that the lake was open to the ocean and contains marine shells consistent with an estuarine environment. The...
Resource Type:: Technical Report

Allocation of SISAL program graphs to processors using BLAS

Creator:: Raisinghani, Manoj H.
Abstract:: There are a number of well known techniques for extracting parallelism from a given program. They range from hardware implementations, building restructuring compilers or reorganizing of programs so as to specify all the available parallelism. The success rate of any of the known techniques is rather poor over all types...
Resource Type:: Masters Thesis
Full Text:: BLAS AN ABSTRACT OF THE THESIS OF Manoj Raisinghani for the degree of Master of Science in

An efficient data-subspace two-dimensional magnetotelluric inversion and its application to high resolution profile across the San Andreas Faults at Parkfield, California

Creator:: Siripunvaraporn, Weerachai
Resource Type:: Dissertation
Full Text:: low resistivity (3 l m, 250-m wide) can extend to 10-km depth. If interpreted to result from fluid

Analysis and modeling of coplanar on-chip interconnects on silicon substrates

Creator:: Luoh, Yi
Abstract:: The electrical behavior of on-chip interconnects has become a dominant factor in silicon-based high speed, RF, and mixed-signal integrated circuits. In particular, the frequency-dependent loss mechanisms in heavily-doped silicon substrates can have a large influence on the transmission characteristics of on-chip interconnects. To optimize the performance of the integrated circuit,...
Resource Type:: Masters Thesis
Full Text:: closed-form expressions for the frequency-dependent line parameters R(w), L(w), G(w), and C(w) for

Analysis and modeling of microstrip on-chip interconnects on silicon substrate

Creator:: Lan, Hai
Abstract:: The electrical performance of on-chip interconnects has become a limiting factor to the performance of modern integrated circuits including RFICs, mixed-signal circuits, as well as high-speed VLSI circuits due to increasing operating frequencies, chip areas, and integration densities. It is advantageous to have fast and accurate closed-form expressions for the...
Resource Type:: Masters Thesis
Full Text:: expressions for the frequency-dependent line parameters R(w), L(w), G(w), and C(w) for microstrip-type on

Evaluation of a Variable Mixing Efficiency Parameterization on the Simulation of Last Glacial Maximum (LGM) Oceanic Circulation

Creator:: Thorstensson, Danil
Abstract:: This study tested the utility of a variable mixing efficiency formulation proposed by Mashayek, et al. (2017) for use in oceanographic models other than the modern, pre-industrial ocean. This formulation is used to calculate diapycnal (vertical) mixing due to unresolved subgrid-scale processes. Results from Last Glacial Maximum (LGM) simulations for...
Resource Type:: Honors College Thesis
Full Text:: Efficiency of Ocean Mixing, J. Phys. Oceanogr. 50, 2141, DOI: 10.1175/JPO-D-20-0083.1. St. Laurent, L. C

Model extraction of a paddle in plastic surface-mount RF-IC packages

Creator:: Sundberg, Garth
Abstract:: Plastic packaging is a cost-effective solution for housing RF and microwave integrated circuits in low cost communication devices. While enabling low cost packaging of integrated circuits, plastic packages including the circuit ground patch (paddle) inside the package can have a significant parasitic effect on circuit performance. The purpose of this...
Resource Type:: Masters Thesis
Full Text:: wire passes [29]. Since the ( l Itoum ~r ~ E--Lines of Symmetry 2.8 tnm 1 " r/ rum Size

Metal fill considerations for on-chip interconnects and spiral inductors

Creator:: Shilimkar, Vikas S.
Abstract:: Variability in circuit performance due to process defects is a major concern in integrated circuit (IC) fabrication. Advanced IC manufacturing processes employ Chemical-Mechanical Polishing (CMP) for planarization of oxide and metal layers. CMP defects result in variations in the oxide and metal topographical profile. To reduce these topographical variations, electrically...
Resource Type:: Masters Thesis
Full Text:: p.u.l. Transmission Line Parameters at 10GHz: R, L, G, C

A base control Doherty power amplifier design for improved efficiency in GSM handsets

Creator:: Ferwalt, Darren W.
Abstract:: In cellular telephones, RF power amplifiers consume a significant part of the total phone current. Reducing the average PA current will extend battery life. In GSM systems the handset is commanded by the base station to transmit at power levels lower than full power much of the time. A Doherty...
Resource Type:: Masters Thesis
Full Text:: 4 PCS1900 (Personal Communication System), 1900 MHz GSM band in the US. PA#1 PA#2 RL L = λ/4 Z0

Modeling and Design of Interconnects and Passive Components for Millimeter-Wave Integrated Circuits in Silicon

Creator:: Zheng, Lei
Abstract:: For mmWave Integrated Circuit (IC) design, co-integration of passives can reduce size and power consumption, increase reliability, and reduce overall cost. However, skin and proximity effects in the metallization are aggravated at mmWave frequencies, resulting in increased attenuation and degradation of overall performance. Furthermore, tight integration of passive components (to...
Resource Type:: Dissertation
Full Text:: spiral inductor: (a) top view; (b) side view. 6 1.7 Illustration of the frequency-dependent L andQ

ScholarsArchive@OSU

Paleoseismic Record of Peninsula Segment Earthquakes on the San Andreas Fault near San Francisco, CA and possible NSAF linkage to Cascadia

Allocation of SISAL program graphs to processors using BLAS

An efficient data-subspace two-dimensional magnetotelluric inversion and its application to high resolution profile across the San Andreas Faults at Parkfield, California

Analysis and modeling of coplanar on-chip interconnects on silicon substrates

Analysis and modeling of microstrip on-chip interconnects on silicon substrate

Evaluation of a Variable Mixing Efficiency Parameterization on the Simulation of Last Glacial Maximum (LGM) Oceanic Circulation

Model extraction of a paddle in plastic surface-mount RF-IC packages

Metal fill considerations for on-chip interconnects and spiral inductors

A base control Doherty power amplifier design for improved efficiency in GSM handsets

Modeling and Design of Interconnects and Passive Components for Millimeter-Wave Integrated Circuits in Silicon

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