The purpose of the thesis is to design, construct,
program, and test an automatic integrated circuit test
system. The class of integrated circuits tested was restricted
to digital integrated circuits. The general concept
of testing a digital integrated circuit is based on
the truth table of that circuit. A combination...
The object of this work was to design and fabricate an integrated circuit using Integrated Injection Logic. Integrated Injection Logic (I[superscript 2] L) is a relatively new field and has many inherent advantages. These have been exploited in this work. Logic for the desired functions was designed and implemented in...
A short-circuit-protected line-driver circuit is
particularly adapted for use in a CMOS differential line-driver
system, where one line-driver circuit provides a
true output signal, and another line-driver circuit
provides a complementary false output signal. A short-circuit
is sensed by measuring current through a secondary
pull-up transistor, and disabling a primary...
The electrical performance of on-chip interconnects has become a limiting factor to the performance of modern integrated circuits including RFICs, mixed-signal circuits, as well as high-speed VLSI circuits due to increasing operating frequencies, chip areas, and integration densities. It is advantageous to have fast and accurate closed-form expressions for the...
The electrical behavior of on-chip interconnects has become a dominant factor in silicon-based high speed, RF, and mixed-signal integrated circuits. In particular, the frequency-dependent loss mechanisms in heavily-doped silicon substrates can have a large influence on the transmission characteristics of on-chip interconnects. To optimize the performance of the integrated circuit,...
Energy consumption is one of the primary bottlenecks to both large and small scale modern compute platforms. Reducing the operating voltage of digital circuits to voltages where the supply voltage is near or below the threshold of the transistors has recently gained attention as a method to reduce the energy...
The purpose of this study is to develop experimental techniques to
characterize typical interconnect discontinuities, including bends, steps, T
junctions, vias and pads, which are the most commonly encountered
interconnections in high speed digital integrated circuits, hybrid and
monolithic microwave circuits and electronic packages. The time domain
reflection response of...
The design of high-performance, high-speed clock generation and distribution becomes challenging in terms of phase noise, jitter and power consumption, due to the fast development of communication and computing systems. Injection locking is a promising clocking technique since it can significantly improve the energy efficiency, suppress the phase noise of...
Recent advances in high density low cost RF and microwave three dimensional
integration technologies using LTCC(Low Temperature Cofired Ceramics),
laminate and other multilayer hybrid and integrated circuits have increased interest
in the design of embedded passive components such as inductors, capacitors and
filters. The purpose of this study is to...
Plastic packaging is a cost-effective solution for housing RF and microwave integrated circuits in low cost communication devices. While enabling low cost packaging of integrated circuits, plastic packages including the circuit ground patch (paddle) inside the package can have a significant parasitic effect on circuit performance. The purpose of this...