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  • Analysis and modeling of multi-mode effects in coplanar waveguide bends

    Creator:
    Senguttuvan, Rajarajan
    Abstract:
    A novel method for modeling bends in coplanar waveguides (CPWs) is described. The CPW can be viewed as a pair of parallel coupled quasi-slot lines. Bends in the CPW are modeled as a non-uniform coupled line system in terms of their even- and odd- mode characteristics. This modeling approach is...
    Resource Type:
    Masters Thesis
    Full Text:
    degree of Master of Science in Electrical and Computer Engineering presented on December 8, 2003. Title

  • CAM : a new Circuit Augmentation Method for modeling interconnects and passive components

    Creator:
    Kolstad, Joel W.
    Abstract:
    Contemporary circuit design involves significant computer-based simulation, calling for a balance between circuit model accuracy and simulation run time. Traditionally, circuit modelers concentrated on producing either (1) physically-based models, where each element in the model correlates to a physically meaningful aspect of the device being modeled or (2) mathematically-based "macromodels,"...
    Resource Type:
    Masters Thesis
    Full Text:
    Weisshaar Contemporary circuit design involves signi…cant computer-based simulation, calling for a balance

  • Power estimation of superscalar microprocessor using VHDL model

    Creator:
    Zhang, Wanpeng
    Abstract:
    Power optimization becomes more and more important due to the design cost and reliability. Sometimes high power consumption means expensive package cost and low reliability. The first step in optimizing power consumption is determining where power is consumed within a processor. While system-level code tracing and bit transition calculation are...
    Resource Type:
    Masters Thesis
    Full Text:
    data. 2.3 Power Estimation Techniques Circuit simulation based techniques [15][16] simulate the

  • Time domain electromagnetic simulation of VLSI interconnects

    Creator:
    Falconer, Maynard C.
    Abstract:
    Current trends in integrated circuit technology are continuing towards physically smaller components and related structures. Interconnects between circuit components have reached sub-micron dimensions which can not be modeled accurately by the current ideal microstrip analysis based techniques. These techniques often assume that the structure being modeled is perfectly conducting, smooth,...
    Resource Type:
    Masters Thesis
    Full Text:
    VLSI INTERCONNECTS INTRODUCTION Current trends in integrated circuit technology are continuing