Plastic packaging is a cost-effective solution for housing RF and microwave integrated circuits in low cost communication devices. While enabling low cost packaging of integrated circuits, plastic packages including the circuit ground patch (paddle) inside the package can have a significant parasitic effect on circuit performance. The purpose of this...
Iron epoxy composite materials were made and their relative magnetic permeability was measured. A measurement device was created to measure the relative magnetic permeability for the specific application. This device proved to be accurate and reliable. The magnetic properties of composite materials have been shown to be controllable, with a...
With the miniaturization of microelectronics and increase of processor speeds in the last few decades, thermal management is drastically affecting overall packaging and system capabilities. Due to the special needs introduced, research focusing on microscale cooling has increased. This study combines the positive characteristics of single- and two-phase flows in...
Single-layer and three-layer microchannel adsorption devices were fabricated by procedure that was newly developed. Aluminum was chosen for metal housing while the adsorption pair was silica gel and water. Each adsorption layer contained two layers of 250 μm-thick silica gel. Both silica gel layers opened to the same layer of...
The current proliferation of portable electronic devices for personal
communication, business and entertainment has created a demand for high energy density
power supplies. A hydrocarbon fuel with a conversion efficiency of over
15% can provide greater energy density than current battery technology for these
applications. Current micro-scale heat engines do...
The focus of this study is to develop a general and low-cost solution-based
process to fabricate micro- and nano-structured semiconductors that are suitable
for electronics. This process uses simple metal halide precursors dissolved in a
solvent (organic or aqueous) and is capable of forming uniform and continuous
thin films via...
A key application of microchannel process technology (MPT) is its implementation in heat exchanger devices, since a larger surface contact area can be realized than in conventional approaches, thus achieving high heat transfer efficiency. To justify high volume production of configurations validated as prototypes, and to select from among the...