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Cost Efficient Fabrication Techniques for Microchips and Interconnects Enabled by Polycaprolactone

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https://ir.library.oregonstate.edu/concern/articles/3n203z989

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  • In this paper we present a novel fabrication technique that utilizes polycaprolactone (PCL) as bonding media due to its low melting temperature property. PCL is biodegradable polyester with a melting point of 60°C, and a glass transition temperature of -60°C [1-10]. It is employed as a rapid bonding technique in the fabrication process that readily produces complete microfluidic chips. The microchannels are produced via laser ablation micromachining and thermal embossing, followed by bonding with PCL. The PCL is uniformly coated on a piece of polymer sheet to produce a thin film on its surface. A complete microfluidic channel is formed by enclosing the open channel with the PCL-coated polymer piece. This fabrication technique lends itself readily to various polymers, such as (poly)methylmethacrylate (PMMA), polycarbonate (PC), polyetherimide (PEI), and poly(ethylene terephthalate) (PETE), facilitating device production for a variety of application, even permitting hybrid polymer chips. The bonding was performed rapidly at 60°C. This approach provides a more direct method to generate hard polymer microfluidic chips than classical techniques and is therefore highly amendable to rapid prototyping. This work also explores the use of PCL as an alternative approach to making simple, cost-effective universal adhesive for bonding interconnects. Bonding is performed at 60°C, by placing the adhesive layer in between an interconnect port and a microchip. This method allows for connections to be made easily and quickly.
  • Keywords: laser ablation, microfluidic, interconnects, bonding, fabrication, polycaprolactone
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  • Koesdjojo, M., Nammoonnoy, J., Wu, Y., Frederick, R., & Remcho, V. (2012). Cost-efficient fabrication techniques for microchips and interconnects enabled by polycaprolactone. Journal of Micromechanics and Microengineering, 22(11) doi: 10.1088/0960-1317/22/11/115030
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  • 22
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  • 11
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  • The authors thank the Oregon Nanoscience and Microtechnologies Institute (ONAMI) for its supports.
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