Enhancement of pool boiling heat transfer using nanostructured surfaces on aluminum and copper

Citeable URL: https://ir.library.oregonstate.edu/concern/articles/w3763741v

Descriptions

Attribute Name	Values
Creator	Hendricks, Terry J. Krishnan, Shankar Choi, Changho Chang, Chih-hung Paul, Brian
Abstract	Enhanced pool boiling critical heat fluxes (CHF) at reduced wall superheat on nanostructured substrates are reported. Nanostructured surfaces were realized using a low temperature process, microreactor-assisted-nanomaterial-deposition. Using this technique we deposited ZnO nanostructures on Al and Cu substrates. We observed pool boiling CHF of 82.5 W/cm2 with water as fluid for ZnO on Al versus a CHF of 23.2 W/cm2 on bare Al surface with a wall superheat reduction of 25-38 C. These CHF values on ZnO surfaces correspond to a heat transfer coefficient of ~ 23000 W/m2K. We discuss our data and compare the behavior with conventional boiling theory. Keywords: boiling enhancement, electronic cooling, nanoscale heat transfer Keywords: boiling enhancement, electronic cooling, nanoscale heat transfer
Resource Type	Article
DOI	https://doi.org/10.1016/j.ijheatmasstransfer.2010.02.025
Date Available	2010-06-07T18:09:47+00:00
Date Issued	2010-07
Citation	Enhancement of pool-boiling heat transfer using nanostructured surfaces on aluminum and copper International Journal of Heat and Mass Transfer, Volume 53, Issues 15-16, July 2010, Pages 3357-3365
Journal Title	International Journal of Heat and Mass Transfer
Journal Volume	53
Rights Statement	Copyright Not Evaluated
Publisher	Elsevier
Language	English [eng]
Replaces	http://hdl.handle.net/1957/16187