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Enhancement of pool boiling heat transfer using nanostructured surfaces on aluminum and copper Public Deposited

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https://ir.library.oregonstate.edu/concern/articles/w3763741v

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  • Enhanced pool boiling critical heat fluxes (CHF) at reduced wall superheat on nanostructured substrates are reported. Nanostructured surfaces were realized using a low temperature process, microreactor-assisted-nanomaterial-deposition. Using this technique we deposited ZnO nanostructures on Al and Cu substrates. We observed pool boiling CHF of 82.5 W/cm2 with water as fluid for ZnO on Al versus a CHF of 23.2 W/cm2 on bare Al surface with a wall superheat reduction of 25-38 C. These CHF values on ZnO surfaces correspond to a heat transfer coefficient of ~ 23000 W/m2K. We discuss our data and compare the behavior with conventional boiling theory.
  • Keywords: boiling enhancement, electronic cooling, nanoscale heat transfer
  • Keywords: boiling enhancement, electronic cooling, nanoscale heat transfer
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  • Enhancement of pool-boiling heat transfer using nanostructured surfaces on aluminum and copper International Journal of Heat and Mass Transfer, Volume 53, Issues 15-16, July 2010, Pages 3357-3365
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  • 53
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