Downloadable Content

Download PDF

WangJyiRen1995.pdf Public

File Details

Depositor
Scholars Archive Admin
Date Uploaded
Date Modified
2017-10-25
Fixity Check
passed 2 Files with 2 total versions checked 2025-03-15 18:11:45 -0700
Characterization
File Format: pdf (Portable Document Format)
File Title: A Numerical Study of the Thermal Performance for Surface Mounted and Through-Hole Mounted Integrated Circuits.
Page Count: 92
File Size: 5921669
Original Checksum: 27cc5ccbd06a3d3eeaeaead46cc4b916
Mime Type: application/pdf
User Activity Date
User Scholars Archive Admin has attached WangJyiRen1995.pdf to A numerical study of the thermal performance for surface mounted and through-hole mounted integrated circuits October 25th, 2017 20:52