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File Format: pdf (Portable Document Format)
File Title: A Numerical Study of the Thermal Performance for Surface Mounted and Through-Hole Mounted Integrated Circuits.
Page Count: 92
Original Checksum: 27cc5ccbd06a3d3eeaeaead46cc4b916
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User Scholars Archive Admin has attached WangJyiRen1995.pdf to A numerical study of the thermal performance for surface mounted and through-hole mounted integrated circuits October 25th, 2017 20:52