WangJyiRen1995.pdf Public
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- Scholars Archive Admin
- Déposé le
- 2017-10-25
- Modifié le
- 2017-10-25
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- passed 2 File with 2 total version checked 2024-04-15 16:46:56 -0700
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File Format: pdf (Portable Document Format)File Title: A Numerical Study of the Thermal Performance for Surface Mounted and Through-Hole Mounted Integrated Circuits.Page Count: 92File Size: 5921669Original Checksum: 27cc5ccbd06a3d3eeaeaead46cc4b916Mime Type: application/pdf
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