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Scholars Archive Admin
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2017-08-15
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passed 2 Files with 2 total versions checked 2025-04-15 16:28:50 -0700
Characterization
File Format: pdf (Portable Document Format)
File Title: Mechanical characterization and modeling of solder joints for the secondary side reflow of large IC packages
Page Count: 111
File Size: 10405587
Original Checksum: 6274173a93829054ca066f560db5a00e
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User Scholars Archive Admin has attached YutzieJamesD2000.pdf to Mechanical characterization and modeling of solder joints for the secondary side reflow of large IC packages August 15th, 2017 16:11