Laminar microchannel cooling of integrated circuits Public Deposited

http://ir.library.oregonstate.edu/concern/graduate_thesis_or_dissertations/3b591c69x

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  • Liquid cooled, laminar microchannel heat sinks were earlier proposed by Tuckerman for cooling high heat generating integrated circuits and high power microwave generation systems using photoconductive switches. A method of computationally analyzing the heat sinks is presented which produces the desired temperature and velocity distributions within the heat sinks. The problem was solved in two different ways. First, computational techniques were developed to investigate the problem assuming fully developed temperature and velocity profiles. Second, the hydro-thermal code TEMPEST was used to solve the developing problem. A comparison was made between the results of this study and Landrum's integral analysis. Other analytical comparisons were made. A parametric study was performed which considers the effect of geometric parameters on the solution. From this parametric study, trends were observed which allowed optimization of the geometric parameters of the design. The optimization involved a specified pressure drop across the heat sink. The optimized design was one which had the lowest peak silicon temperature with a given pressure drop across the heat sink. For every given pressure drop across the heat sink, there was an optimal design. Optimized heat transfer performance characterized by nondimensional peak silicon temperature may be related to the pressure drop across the heat sink so the cooling effect can be compared to its cost in terms of pumping power. An evaluation of the fully developed momentum and energy assumptions was presented. The developing solution was solved for cases both near the optimized design and for cases which deviated substantially from the optimized design. The fully developed momentum assumption provided accurate velocity profiles in all cases considered. The hydrodynamic entry length can be neglected in most cases. The accuracy of the fully developed energy assumption varied considerably with geometric parameters. The fully developed energy solution did not accurately represent the developing solution for microchannels with small fin width to channel width ratios and large channel aspect ratios. For microchannels with large fin width to channel width ratios and small channel aspect ratios, the fully developed solution accurately represented the developing solution. The fully developed assumption provided accurate temperature profiles in cases at or near the optimum design as determined by the methods in this report. The effects of variable fluid specific heat and thermal conductivity were considered by comparing the temperature and velocity profiles to constant property cases. The assumption of constant fluid properties provided a conservative estimate of the peak silicon temperature. This suggested using the constant property assumption in order to provide a margin of safety and to simplify the computation.
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