Traditional electronic systems are usually fabricated via printed circuit boards (PCBs). In a regular PCB, the electronic components are placed and mounted on a two-dimensional board. Such a component layout limits the freedom in the component placement process which results in larger electronic devices. With the use of Additive Manufacturing technology, it is possible to create 3D Circuits which are structures with embedded electronics. 3D circuits allow for easier electrical component placement which results in building smaller electrical devices, but they have disadvantages too. Heat transfer is a big concern in creating functional 3D circuits since the electrical components which generate heat are placed in a compact space. To solve this issues, there is a need for a design framework in which an automation tool places the electrical components in the most optimum way to achieve the minimum electrical resistance resulting in less wire length and possibly smaller designs. The automation tool considers heat transfer constraints to prevent electrical components from overheating. In this thesis design automation methods for 3D circuits have been explored and implemented as a proof-of-concept of future commercial grade software that will facilitate 3D circuit design. The developed automation tool uses a stochastic approach (Genetic Algorithm) to optimize the electrical component layout.
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