Diffusion bonding and embossing of Zr[subscript 46.7]Ti[subscript 8.3]Cu[subscript 7.5]Ni₁₀Be[subscript 27.5] bulk metallic glass forming alloy Public Deposited

http://ir.library.oregonstate.edu/concern/graduate_thesis_or_dissertations/5m60qw92r

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  • A Bulk Metallic Glass (BMG) is an amorphous solid with thickness greater than 1mm. Material properties of BMG, like twice the strength of regular steels and excellent corrosion resistance, make them ideal materials for fabrication of MEMS and MECS devices which have attracted a lot of research activity recently. Diffusion bonding and embossing was attempted for Zr46.7Ti8.3Cu7_5NiloBe27.5 (Vit4), a BMG forming alloy. Determination of experimental parameters based on material properties like viscosity and diffusivity, is discussed in this paper. To achieve embossing, various dies were pressed into the Vit4 pieces which were softened by heating them to temperatures close to or above the glass transition. Characterization of the replicated surface using an optical microscope and a surface profiler showed that a replication accuracy of 97% could be achieved successfully. Bonding of the two Vit4 pieces was facilitated by holding them at an elevated temperature for a certain time and under a certain pressure. Differential Scanning Calorimetry (DSC) revealed that the material did not crystallize during embossing but it underwent a phase separation. Bonding was achieved for runs where Vit4 crystallized while a weak bond resulted in the run where the sample was amorphous. Thus it was concluded that Ni diffusion of more than 150 nm was required for formation of a strong bond.
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