A comparative study of the performance of pin finned heat sinks for cooling electronic components by natural convection Public Deposited

http://ir.library.oregonstate.edu/concern/graduate_thesis_or_dissertations/9k41zj536

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  • A study was conducted to determine the heat transfer characteristics of pin finned heat sinks in natural convection. Three pin diameters were studied: 0.238 cm, 0.318 cm and 0.396 cm. The pins were attached to the base in two arrangements, triangular and rectangular, forming a horizontal array. Pin spacing was parameterized by using pitch-to-diameter ratios of P/D = 2.0, 2.5 and 3.0 for each pin diameter. This study presents information both for thermal design and heat transfer results. It was found that the largest spacing, rectangular pin arrangement and black anodized surface offered the best power dissipation characteristics. The heat transfer results are presented in terms of the average Nusselt and Grashof numbers based on diameter. For Grashof numbers below 10 the data presented a variation characteristic of the behavior of small wires. A comparison was made between a heat sink studied in this project and typical heat sinks with rectangular fins employed in the electronic industry. The pin finned heat sink displayed 46% and higher power densities than the ones with rectangular fins.
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