Loss tangent and dielectric constant of solder mask materials measured with split-post dielectric resonators Public Deposited

http://ir.library.oregonstate.edu/concern/graduate_thesis_or_dissertations/df65vb396

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  • A constant push from society for more information with richer content simultaneously available at the consumers fingertips have pushed the speeds of electronics to extremes. Bus lines on circuit boards responsible for data communication are being pushed to their limit to meet these demands. As data busses are pushed to the limits optimization becomes the key in meeting high speed data transmission goals Different types of signaling techniques such as PCI express combine data organization with differential traces, and transmission line reflection techniques to help push more data down the pipe line with less power. Inevitably, to fully optimize any communication channel, the physical properties alone have to be considered first. This thesis looks at the dependence of solder mask materials on temperature and more importantly humidity. In different regions of the world and even in the United States, the environmental conditions can vary from 21 C at 10% relative humidity to 38 C and 100% relative humidity. In order to provide a consistent communication channel, the materials that make up the channel have to be somewhat electrically impervious to these environmental changes. This thesis will show through measurements of dielectric constant and loss tangent via split post dielectric resonators that currently this is not the case. New materials and specifications will have to be developed and formulated in order to meet the inevitably higher speed demands from consumers.
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