Mechanical characterization and modeling of solder joints for the secondary side reflow of large IC packages Public Deposited

http://ir.library.oregonstate.edu/concern/graduate_thesis_or_dissertations/f4752k71z

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  • As the drive continues to reduce the size of Printed Wiring Assemblies (PWAs), improve performance of electronic assemblies, and reduce costs of these products, reliable secondary (bottom) side reflow operations must be developed. Attaching Surface Mount Technology (SMT) components to the secondary side of a Printed Circuit Board (PCB) is accomplished by placing components on the PCB's secondary side and processing it through the reflow oven at this point. This board is then flipped over so that more components can be placed on the side that is facing up (primary side). The PCB must again be processed through the reflow oven. Large Integrated Circuit (IC) packages that are soldered to the secondary side fall off of the PCB during reflow of the primary side. Intuition may lead one to believe this is caused solely by weight, size, etc., but experienced personnel are not able to consistently predict which components will fail. The purpose of this work is to convey the necessary knowledge to explain and predict the behavior of components during Secondary Side Reflow (SSR). This thesis will ultimately present a method by which guidelines for SSR can be created. Currently, SSR is limited to small passive devices and small Integrated Circuit (IC) packages. It is anticipated that future PWA designs will require large ICs such as Quad Flat Packs (QFP) and Ball Grid Arrays (BGA) on the secondary side. A large variety of SMT components are available, but the focus of this research was directed towards large IC packages. Current manufacturing guidelines for such products do not exist and development of these are imperative if a costly trial and error approach is to be avoided. In an environment where product technology advancement and cost reduction are key to survival, industry must develop and understand this manufacturing process. Cost savings from SSR will be most directly realized with compressed product development cycles, reduced use of PCBs, components, and raw materials, and more efficient use of manufacturing capital and employees. These cost savings would be realized nearly immediately after a set of manufacturing guidelines is developed.
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