New configurations of bandpass filters in single and multilayer environment Public Deposited

http://ir.library.oregonstate.edu/concern/graduate_thesis_or_dissertations/rr172260j

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  • Mobile and telecommunication industry has experienced tremendous growth in the recent past. Miniaturization and increased functionality have become necessary for all passive components in the system. Bandpass filters are critical passive components in any communication system and the existing designs in the crucial 1-10 GHz bandwidth suffer many drawbacks. For instance, widely used coupled line bandpass filters have undesirable harmonics at twice the center frequency and generally offer large footprints at these frequencies. Several other variations of bandpass filters have been reported in the literature. However, many of the existing filter designs do not take optimum advantage of the emerging technologies such as Low Temperature Co-fired Ceramic (LTCC) and Multichip Module Deposition (MCM-D), where compact geometries can be realized in a multi-level multi-conductor environment. Basically, design of high performance bandpass filters needs to address two important aspects. First, an efficient way of suppressing the higher order harmonics needs to be embedded into the filter geometry while maintaining the passband performance. Second, the filter configurations need to be compact and suitable for the current multilevel fabricational technologies. This thesis attempts to address both of these aspects by proposing new bandpass filter configurations in single and multilayered environments. A simple design procedure is developed for synthesizing a bandpass filter based on an equivalent admittance inverter parameter approach. This procedure can be applicable for a wide range of filter geometries. Several new techniques to tackle the issue of higher order harmonics are proposed. New configurations of compact filters are proposed in single and multilayer configuration with harmonic suppression. The challenges faced in designing these filters are discussed. Some of the challenges include overcoming the problem of interconnections between the different layers and reducing the design time for these configurations. To address these challenges, new, multilevel vialess filters are proposed, where the broadside coupling between layers is effectively used as a part of the filter characteristic to interconnect different layers. Further, an innovative algorithm to achieve first time successful design based on electromagnetic simulations has been proposed. The proposed new filter configurations have been validated with the full-wave electromagnetic simulation as well as measurement. This research on new configurations of efficient bandpass filter realization should prove useful for a wide range of applications in the frequency range of 1 and 20 GHz.
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