X-ray computerized tomography of particleboard to predict through-thickness density profile Public Deposited

http://ir.library.oregonstate.edu/concern/graduate_thesis_or_dissertations/x633f299c

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  • Particleboard is a widely used composite panel product consisting of consolidated wood particles and adhesive. On a macro level the panel appears to be homogeneous, however, its density varies both throughout the plane of the panel as well as through its thickness. Of concern for this thesis is the through-thickness density profile which strongly influences the panel's mechanical properties such as modulus of rupture, modulus of elasticity and internal bond strength. Panel manufacturers realize this importance and, as a result, have begun to use some methods to measure the density profile in their laboratories for quality control. However, present methods provide data for only a small portion of the production and often hours if not days after the panel was produced. This study proposes and evaluates a method using a X-ray computerized tomography technique to predict the through-thickness density profile. Three types of commercially produced particleboards were scanned using a system consisting of an X-ray densitometer and a computer acquisition system to collect the attenuation data. The density profile of each sample was then predicted by using a computer algorithm (C language) in which two mathematical models were applied. A two-degree polynomial regression function was used to evaluate the accuracy of the models. Comparisons were made of the predicted to actual density profiles for the same sample. A good agreement, a correlation value of r² = 0.822, between the predicted and actual density profiles was found indicating that this technique does provide good estimation of density profiles. This study provides the necessary knowledge to design a valuable nondestructive testing tool for use in monitoring the quality of particleboard and other similar composite products on the production line and on a real time basis.
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