Millimeter-wave (mm-wave) technology promises high speed, high system capacity and
low latency interconnects with reduced cost. Applications like high data-rate wireless
links, next generation automotive sensors and security body scanners highly depend on
mm-wave technology innovations. As operating frequency moves to higher mm-wave
bands, shrinking antenna dimensions enable co-integration of IC and antenna. Limited
transistor output power at mm-wave requires multi-element arrays to satisfy communication and radar link budgets. This dissertation presents a wafer-scale compatible
IC-antenna co-integration for efficient and scalable mm-wave antenna interfaces. The
proposed IC-antenna co-integration approach is demonstrated through single antenna
transmitters, a concurrent dual-polarization receiver front-end and polarization-duplex
Chapter 2 discusses the challenge of mm-wave IC-antenna interfaces with prior art
including antenna-in-package (AiP) and on-chip antennas. The 60 GHz efficient, scalable and wafer-scale compatible IC-antenna co-integration approach is presented demonstrating wide bandwidth and large efficiency which are comparable to system-level AiP
techniques at a lower cost and fabrication complexity.
Chapter 3 extends the proposed approach to a concurrent 60 GHz dual-polarization
receiver front-end for short-range imaging/communication applications and polarization diversity based MIMO links. Active cancellation between orthogonal polarizations is adopted to achieve ∼ 30 dB cross-polarization leakage cancellation and concurrent dual-pol reception.
Chapter 4 presents a 60 GHz simultaneous transmit and receive front-end to achieve
efficient polarization-duplex operation based on dual-polarization IC-antenna co-integration.
Transmitter leakage is suppressed at receiver input and output by intrinsic antenna isolation and a feed-forward passive canceller. Total average self-interference cancellation
>40 dB is achieved for 1.07 GHz RF bandwidth at 60 GHz in the presence of a reflector.