Graduate Thesis Or Dissertation
 

The Design and Construction of a Cost-Effective Atomic Layer Deposition System for Thin Film Growth

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https://ir.library.oregonstate.edu/concern/graduate_thesis_or_dissertations/zg64tt67k

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  • This paper describes the construction and use of a cost-effective custom-built atomic layer deposition (ALD) system, as well as the investigation of aluminum oxide atomic layer deposition using trimethylaluminum and water. For this research, a cost-effective ALD system was constructed for less than $8,000 using existing parts that were given by other research groups or found in storage. Using this custom-built ALD system, aluminum oxide film can be deposited on a Si-wafer (100) at 200° C with the growth per cycle (GPC) of 1.04 Å/cycle and 99 % film uniformity, which closely matches the reported GPC by others using commercial ALD systems. Our results show that a custom-built ALD system could perform comparably to commercial ALD system and is suitable for both academic research and educational demonstration. With optimized operational process settings, GPC remains constant even though the number of ALD reaction cycles is changed. This can be used as a metric to verify that material is deposited by self-limiting surface reaction. Our findings suggest that GPC depends on the number of ALD reaction cycles if operational process settings are not optimized. We found that GPC decreases asymptotically to ideal GPC as purge duration increases. Once GPC reaches a stabilized value (ideal GPC), additional purge duration has no noticeable effect on GPC and uniformity of the deposited film. Atomic force microscopy (AFM) measurement shows that film deposited by ALD has smooth surface with surface roughness ~ 0.2 nm. The influence of substrate temperature was also studied, for values between 25° C and 350° C.
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