This thesis investigates a way to fabricate P-N junctions by
percussive welding. The theoretical basis of percussive welding, design
considerations of the apparatus used, and the electrical characteristics
of the junctions were the main objectives of this investigation.
P-type silicon wafers and gold wire doped with arsenic as a
N-type...
Problems with Hall devices for instructional use in undergraduate laboratories stimulated this investigation for development of rugged, easily constructed, inexpensive, electrically reproducible Hall devices with high output voltage. Silicon was chosen as the Hall-plate material on the basis of cost and availability. Advantages and disadvantages of various plate shapes, sizes,...
A technique was investigated in which a silicon crystal was
used as a very sensitive detector of sub-nanogram quantities of
boron. The unknown quantity of boron was spread uniformly on
the surface of an n-type silicon wafer which was then baked for
diffusion. The measured depth of the p-n junction...
This thesis presents some experimental results for
producing controlled PN and NPN diffused structures in
silicon by varying the strength of the diffusion sources.
Boron diffusions were carried out in a N₂ atmosphere at
1200°C with 10%, 20%, 30% and 40% B₂0₃ in silicic acid as
sources. Phosphorus diffusions were...
The use of double-diffused n-type MOS transistor
(DN-MOS) in a complementary MOS random-access-memory (CMOS
RAM) cell is the main objective of this investigation.
DN-MOS transistors and conventional p-channel MOS
transistors on the same chip have been successfully fabricated.
Process sequence effects on device threshold voltage
and channel length are discussed....
The properties of evaporated aluminum-oxide films were investigated. The characteristics of MOS devices
made with single-layer aluminum-oxide films and double-layer
films which were made by evaporating aluminum oxide
over thermally-grown silicon dioxide as gate insulation
have been investigated. Vacuum-evaporated aluminum oxide
has features which are suitable for fabricating MOS devices....
Low temperature noise measurements on junction field-effect
transistors tend to substantiate a theory of low frequency field-effect
transistor noise based on the presence of generation centers in the
gate-channel depletion region. Measurements of device noise voltage
versus temperature reveal pronounced maxima and minima over the
temperature range of 300° K...
The influence of surface fields on the breakdown voltage
is studied experimentally for p⁺-n silicon diodes with
a junction depth of 0.5μ in order to improve the curvature-
limited breakdown of the diffused, shallow-collector
junction of a microwave transistor.
Devices with a gap in the gate metal electrode are
also...
Some important factors that affect the dimensional
control of oxide films on silicon were studied. Both N- and
P-type silicon with resistivities in the range of
0.014 to 200 ohm-cm and a (111) surface orientation
were employed in this experiment. The etching rates of
silicon dioxide in hydrofluoric acid (111)...
This paper is concerned with the determination of
gallium arsenide resistivity by measurement of attenuation of microwave energy at 7500 megacycles transmitted
through a slice.
The first section of this paper describes gallium
arsenide properties as compared to silicon, germanium,
silicon carbide, and diamond. A description is then
given of...