An analysis of substrate noise coupling in mixed-signal circuits has been performed in the TSMC 0.25 [mu]m lightly doped and heavily doped CMOS processes. Methods to minimize noise coupling in both the chip design and board design phases are presented along with techniques for accurate circuit simulation of noise coupling....
A methodology for rapid estimation of substrate noise generated by digital circuitry in mixed-signal circuits is presented. This methodology is incorporated into the Silencer! framework, and also provides for future improvements including pre-layout noise estimation. Measurements of a test chip fabricated in the TSMC o.25[mu]m heavily doped logic process validate...
This thesis presents the contributions to substrate noise due to supply coupling and the effect of pin parasitics on the substrate noise generated by digital circuits. Various sources of substrate noise and their effect on analog circuits sharing the same substrate are discussed. A simulation approach to isolate the various...
The substrate noise injected by a stepped buffer circuit into two single-ended 1.5GHz low noise amplifiers is examined for a heavily doped 0.25µm CMOS process. The difference in the LNA noise rejection is characterized as a function of the size and placement of substrate contacts. The use of a resistive...
In this thesis, the performance degradation of a phase-locked loop due to substrate noise is examined. A new analytical equivalent circuit model for substrate noise coupling is derived for a heavily doped silicon substrate. The model has been validated with measured data from a 0.35 μm CMOS process. Since the...