Capacitor discharge welding (CDW) is a rapid solidification joining process under
the influence of one-dimensional thermal gradients. Although CDW is useful for joining
small parts and dissimilar metals, CD welded joints have a large variability in weld
strength. CDW is not widely accepted because of a lack of automated process...
Miniature energy and chemical systems (MECS) are miniature thermal, fluid, and chemical devices in the mesoscale size range between a sugar cube and a human fist. MECS take advantage of improved rates of mass and heat transfer that have been observed at the microscale. There are many potential applications for...
Micromanufacturing consists of processes for producing structures, devices or systems with feature sizes measured in micrometers. Micromanufacturing began in the mid-1960's with microelectronics fabrication technology. In the 1980's, Micro-Electro-Mechanical Systems (MEMS) began to be developed, in which electrical and mechanical subsystems were integrated at small scales. More recently, Microtechnology-based Energy...
The miniaturization of energy, chemical and biological systems for distributed and portable applications, known as process intensification, is realized by the enhancement in heat and mass transfer performance within high surface-to-volume ratio microchannels. Fabrication of devices for process intensification is achieved in part by microlamination techniques. These techniques consist of...
Materials which can be changed in shape and size when exposed to a magnetic field are called magnetostrictive materials. The magnetostrictive material was developed for use in the many actuator industries. A single crystal of magnetostrictive material is used to maximize its magnetostrictive response. It can be produced by the...
The miniaturization of Microtechnology-based Energy, Chemical and Biological Systems (MECS) is made possible by the use of high aspect ratio microchannel arrays to increase the surface-area-to-volume ratio of the flow conduits within the devices, resulting in an improvement in the heat and mass transfer performance of the devices. However, advantages...
Several 316 stainless steel meso-scopic devices were made using a diffusion
soldering process. Tensile strength and pressure drop of the devices were
measured and metallurgical examinations were made of the joints. Continuous
bonds were observed in the sample cross-section specimens. Strengths of the
diffusion soldered joints were up to 56%...
The paper describes a Thermally-Enhanced Edge Registration (TEER) technique for precision aligning large numbers of laminae in diffusion bonding processes. This technique is particularly relevant for the formation of micro heat exchangers and microreactors requiring highly paralleled microchannel arrays but is also being used to register other laminated devices with...
A new adhesive bonding method is introduced for microlamination architectures, for producing low-temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses and flow features, resulting in approximately 50% fewer laminae over traditional methods. These lamina designs...
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Brian K. Paul
A new adhesive bonding method is introduced for microlamination architectures
Chemical microreactors offer opportunities for portable power generation, on-site
waste remediation and point-of-use chemical synthesis. Much of the existing
development of microreactor devices involves silicon-based microfabrication techniques.
It is recognized that new refractory materials are important to realizing high-temperature
microreactors. Requirements of these materials include high-temperature resistance,
chemical inertness and...