With increasing operating frequencies in CMOS RF/microwave integrated circuits,
the performance of on-chip interconnects is becoming significantly affected by the lossy
substrate. It is the purpose of the first part of this thesis to develop a rigorous field
theoretic analysis approach for efficient characterization of single and multiple coupled
interconnects...
The properties of linear active coupled lines consisting of
electrically long GaAs MESFET structures are investigated for possible
applications as traveling-wave broad-band amplifiers. In addition,
the nonlinear coupled Schottky lines are studied for applications as
voltage tunable circuit elements.
The analysis of the general active asymmetric coupled transmission
lines in...
A new CAD-oriented methodology for the full-wave broadband characterization of coupled microstrip structures for RF/microwave and high-speed digital circuits is presented. The characterization methodology is based on the finite difference time domain (FDTD) technique combined with a systematic extraction procedure using the normal mode approach and multiport network concepts. The...
Accurate and efficient computational methods to evaluate the
quasi-TEM parameters of various planar structures such as microstrips,
coplanar lines and coplanar waveguides are developed. The characteristic
parameters of all these structures which are used extensively
in microwave integrated circuits for applications as transmission
lines and other circuit elements are computed...
The advent of low-cost RFIC's fabricated in Silicon-based technologies has led to the use of monolithic lumped elements which are located on-die. While it is clearly advantageous to have a high degree of integration and thus fewer off chip elements, parasitic losses due to semiconducting substrate effects can be a...