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Filtering by: Creator Chang, Xiao Lan Remove constraint Creator: Chang, Xiao Lan Advisor Weisshaar, Andreas Remove constraint Advisor: Weisshaar, Andreas

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  • Analysis and modeling of coplanar on-chip interconnects on silicon substrates

    Creator:
    Luoh, Yi
    Abstract:
    The electrical behavior of on-chip interconnects has become a dominant factor in silicon-based high speed, RF, and mixed-signal integrated circuits. In particular, the frequency-dependent loss mechanisms in heavily-doped silicon substrates can have a large influence on the transmission characteristics of on-chip interconnects. To optimize the performance of the integrated circuit,...
    Resource Type:
    Masters Thesis
    Full Text:
    suggestions. I would also like to thank my friends and colleagues, Ji Zheng, Hai Lan, Chi-Young Lim, Daniel

  • Analysis and modeling of monolithic on-chip transformers on silicon substrates

    Creator:
    Mayevskiy, Yevgeniy
    Abstract:
    Passive components, including spiral inductors and transformers, fabricated on silicon-based substrates are placing an increasing demand on radio-frequency integrated circuit (RFIC) design. Performance of the RFIC suffers from several non-ideal effects that must be taken into account in order to create a successful design. In particular, monolithic transformers can be...
    Resource Type:
    Masters Thesis

  • Metal fill considerations for on-chip interconnects and spiral inductors

    Creator:
    Shilimkar, Vikas S.
    Abstract:
    Variability in circuit performance due to process defects is a major concern in integrated circuit (IC) fabrication. Advanced IC manufacturing processes employ Chemical-Mechanical Polishing (CMP) for planarization of oxide and metal layers. CMP defects result in variations in the oxide and metal topographical profile. To reduce these topographical variations, electrically...
    Resource Type:
    Masters Thesis

  • Modelling of on-chip spiral inductors for silicon RFICs

    Creator:
    Melendy, Daniel
    Abstract:
    In high-frequency circuit design, performance is often limited by the quality of the passive components available for a particular process. Specifically, spiral inductors can be a major bottle-neck for Voltage-Controlled Oscillators (VCOs), Low-Noise Amplifiers (LNAs), mixers, etc. For designers to correctly optimize a circuit using a spiral inductor, several frequency-domain...
    Resource Type:
    Masters Thesis
    Full Text:
    suggestions. Thanks to my colleagues, Amy Luoh, Hai Lan, and Ji Zheng, for their encour- agement, useful

  • Inductors in high-performance silicon radio frequency integrated circuits : analysis, modeling, and design considerations

    Creator:
    Lutz, Richard D., Jr
    Abstract:
    Spiral inductors are a key component of mixed-signal and analog integrated circuits (IC's). Such circuits are often fabricated using silicon-based technology, owing to the inherent low-cost and high volume production aspects. However, semiconducting substrate materials such as silicon can have adverse effects on spiral inductor performance due to the lossy...
    Resource Type:
    Dissertation
    Full Text:
    -Young Lim and Yeon-Chang Hahm for their encouragement, useful discus- sions, manuscript review, and

  • Modeling and Design of Interconnects and Passive Components for Millimeter-Wave Integrated Circuits in Silicon

    Creator:
    Zheng, Lei
    Abstract:
    For mmWave Integrated Circuit (IC) design, co-integration of passives can reduce size and power consumption, increase reliability, and reduce overall cost. However, skin and proximity effects in the metallization are aggravated at mmWave frequencies, resulting in increased attenuation and degradation of overall performance. Furthermore, tight integration of passive components (to...
    Resource Type:
    Dissertation

  • Equivalent circuit modeling of on-chip magnetic devices based on terminal measurements

    Creator:
    Gaskill, Steven G.
    Abstract:
    The addition of thin-film alloy magnetic materials to integrated circuit processing enables a number of novel monolithic circuits. Examples include fully integrated magnetic field sensors, signal and power galvanic isolation circuits, and power supplies on chip (PwrSoC). There are several benefits to integrating these traditionally off-chip devices, including improved manufacturability,...
    Resource Type:
    Dissertation

  • Enabling metal-fill-aware design of integrated circuits

    Creator:
    Shilimkar, Vikas S.
    Abstract:
    In advanced integrated circuit (IC) processes, the metal fill inserted to meet foundry imposed density requirements degrades the performance of interconnects and passive components which ultimately affects the overall circuit performance. Accounting for this degradation through electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However,...
    Resource Type:
    Dissertation