Index Catalog // ScholarsArchive@OSU

Characterization of coupled microstrip structure using FDTD

Creator:: Kim, Yoonsuk
Abstract:: A new CAD-oriented methodology for the full-wave broadband characterization of coupled microstrip structures for RF/microwave and high-speed digital circuits is presented. The characterization methodology is based on the finite difference time domain (FDTD) technique combined with a systematic extraction procedure using the normal mode approach and multiport network concepts. The...
Resource Type:: Dissertation
Full Text:: Ph.D work. Professors Dr. Ronald Mohier, Dr. Ben Lee, Dr. Andreas weisshaar, Dr. Raghu K. Settaluri

Field theoretic analysis of a class of planar microwave and opto-electronic structures

Creator:: Hahm, Yeon-Chang
Abstract:: With increasing operating frequencies in CMOS RF/microwave integrated circuits, the performance of on-chip interconnects is becoming significantly affected by the lossy substrate. It is the purpose of the first part of this thesis to develop a rigorous field theoretic analysis approach for efficient characterization of single and multiple coupled interconnects...
Resource Type:: Dissertation
Full Text:: members, Dr. T.K. Plant, Dr. R.K. Settaluri, Dr. B. Lee, Dr. U. Moon, and Dr. Solomon Yim, for their time

Electrical recommendations and formulas for metal fill in radio-frequency integrated circuits

Creator:: Gaskill, Steven
Abstract:: With increasing transistor operating frequencies, interconnects and passive devices are becoming performance limiters in integrated circuit (IC) designs. To combat this, the interconnect layers above the active silicon are trending toward low-κ dielectrics and Cu metallization. The use of these new materials has popularized chemical mechanical polishing (CMP) to planarize...
Resource Type:: Masters Thesis
Full Text:: numerical methods, Lee et al. have suggested replacing layers with metal fill by an effective dielectric

Metal fill considerations for on-chip interconnects and spiral inductors

Creator:: Shilimkar, Vikas S.
Abstract:: Variability in circuit performance due to process defects is a major concern in integrated circuit (IC) fabrication. Advanced IC manufacturing processes employ Chemical-Mechanical Polishing (CMP) for planarization of oxide and metal layers. CMP defects result in variations in the oxide and metal topographical profile. To reduce these topographical variations, electrically...
Resource Type:: Masters Thesis

Broadband modeling of on-chip transformers for silicon RFICs

Creator:: Rapolu, Kavitha
Abstract:: Magnetically coupled passive transformers are increasingly integrated on-chip for various analog and radio frequency (RF) applications including direct current (DC) isolation, impedance transformation/matching, and conversion between single-ended and differential signals. A primary motivation for the on-chip integration of transformers is the overall size reduction and reduced cost. However, the performance...
Resource Type:: Masters Thesis

Analysis and modeling of monolithic on-chip transformers on silicon substrates

Creator:: Mayevskiy, Yevgeniy
Abstract:: Passive components, including spiral inductors and transformers, fabricated on silicon-based substrates are placing an increasing demand on radio-frequency integrated circuit (RFIC) design. Performance of the RFIC suffers from several non-ideal effects that must be taken into account in order to create a successful design. In particular, monolithic transformers can be...
Resource Type:: Masters Thesis

Inductors in high-performance silicon radio frequency integrated circuits : analysis, modeling, and design considerations

Creator:: Lutz, Richard D., Jr
Abstract:: Spiral inductors are a key component of mixed-signal and analog integrated circuits (IC's). Such circuits are often fabricated using silicon-based technology, owing to the inherent low-cost and high volume production aspects. However, semiconducting substrate materials such as silicon can have adverse effects on spiral inductor performance due to the lossy...
Resource Type:: Dissertation

Analysis and modeling of multi-mode effects in coplanar waveguide bends

Creator:: Senguttuvan, Rajarajan
Abstract:: A novel method for modeling bends in coplanar waveguides (CPWs) is described. The CPW can be viewed as a pair of parallel coupled quasi-slot lines. Bends in the CPW are modeled as a non-uniform coupled line system in terms of their even- and odd- mode characteristics. This modeling approach is...
Resource Type:: Masters Thesis

Equivalent circuit modeling of on-chip magnetic devices based on terminal measurements

Creator:: Gaskill, Steven G.
Abstract:: The addition of thin-film alloy magnetic materials to integrated circuit processing enables a number of novel monolithic circuits. Examples include fully integrated magnetic field sensors, signal and power galvanic isolation circuits, and power supplies on chip (PwrSoC). There are several benefits to integrating these traditionally off-chip devices, including improved manufacturability,...
Resource Type:: Dissertation

Design of Compact Passive Components and Circuits for RF and Millimeter-Wave Integrated Circuit in Silicon

Creator:: Dong, Xuanyi
Abstract:: Emerging fifth generation (5G) and beyond 5G communication networks are stimulating the design of radio-frequency (RF) and millimeter-wave (mmWave) integrated circuits for wireless transceivers systems. While co-integration of active circuits and diverse passive components becomes feasible at these high operating frequencies, circuit design is faced with significant challenges due to...
Resource Type:: Dissertation

ScholarsArchive@OSU

Characterization of coupled microstrip structure using FDTD

Field theoretic analysis of a class of planar microwave and opto-electronic structures

Electrical recommendations and formulas for metal fill in radio-frequency integrated circuits

Metal fill considerations for on-chip interconnects and spiral inductors

Broadband modeling of on-chip transformers for silicon RFICs

Analysis and modeling of monolithic on-chip transformers on silicon substrates

Inductors in high-performance silicon radio frequency integrated circuits : analysis, modeling, and design considerations

Analysis and modeling of multi-mode effects in coplanar waveguide bends

Equivalent circuit modeling of on-chip magnetic devices based on terminal measurements

Design of Compact Passive Components and Circuits for RF and Millimeter-Wave Integrated Circuit in Silicon

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