Index Catalog // ScholarsArchive@OSU

Creator:: Dong, Xuanyi
Abstract:: Emerging fifth generation (5G) and beyond 5G communication networks are stimulating the design of radio-frequency (RF) and millimeter-wave (mmWave) integrated circuits for wireless transceivers systems. While co-integration of active circuits and diverse passive components becomes feasible at these high operating frequencies, circuit design is faced with significant challenges due to...
Resource Type:: Dissertation

Creator:: Shilimkar, Vikas S.
Abstract:: In advanced integrated circuit (IC) processes, the metal fill inserted to meet foundry imposed density requirements degrades the performance of interconnects and passive components which ultimately affects the overall circuit performance. Accounting for this degradation through electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However,...
Resource Type:: Dissertation
Full Text:: tapeouts and discussions on the technical relevance of this work. Dr. David Yeh from the Semiconductor

Creator:: Lutz, Richard D., Jr
Abstract:: Spiral inductors are a key component of mixed-signal and analog integrated circuits (IC's). Such circuits are often fabricated using silicon-based technology, owing to the inherent low-cost and high volume production aspects. However, semiconducting substrate materials such as silicon can have adverse effects on spiral inductor performance due to the lossy...
Resource Type:: Dissertation

Creator:: Zheng, Lei
Abstract:: For mmWave Integrated Circuit (IC) design, co-integration of passives can reduce size and power consumption, increase reliability, and reduce overall cost. However, skin and proximity effects in the metallization are aggravated at mmWave frequencies, resulting in increased attenuation and degradation of overall performance. Furthermore, tight integration of passive components (to...
Resource Type:: Dissertation

Creator:: Shilimkar, Vikas S.
Abstract:: Variability in circuit performance due to process defects is a major concern in integrated circuit (IC) fabrication. Advanced IC manufacturing processes employ Chemical-Mechanical Polishing (CMP) for planarization of oxide and metal layers. CMP defects result in variations in the oxide and metal topographical profile. To reduce these topographical variations, electrically...
Resource Type:: Masters Thesis

Creator:: Gaskill, Steven G.
Abstract:: The addition of thin-film alloy magnetic materials to integrated circuit processing enables a number of novel monolithic circuits. Examples include fully integrated magnetic field sensors, signal and power galvanic isolation circuits, and power supplies on chip (PwrSoC). There are several benefits to integrating these traditionally off-chip devices, including improved manufacturability,...
Resource Type:: Dissertation

ScholarsArchive@OSU