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  • Modeling and Design of Interconnects and Passive Components for Millimeter-Wave Integrated Circuits in Silicon

    Creator:
    Zheng, Lei
    Abstract:
    For mmWave Integrated Circuit (IC) design, co-integration of passives can reduce size and power consumption, increase reliability, and reduce overall cost. However, skin and proximity effects in the metallization are aggravated at mmWave frequencies, resulting in increased attenuation and degradation of overall performance. Furthermore, tight integration of passive components (to...
    Resource Type:
    Dissertation
    Full Text:
    AN ABSTRACT OF THE DISSERTATION OF Lei Zheng for the degree of Doctor of

  • Analysis and modeling of coplanar on-chip interconnects on silicon substrates

    Creator:
    Luoh, Yi
    Abstract:
    The electrical behavior of on-chip interconnects has become a dominant factor in silicon-based high speed, RF, and mixed-signal integrated circuits. In particular, the frequency-dependent loss mechanisms in heavily-doped silicon substrates can have a large influence on the transmission characteristics of on-chip interconnects. To optimize the performance of the integrated circuit,...
    Resource Type:
    Masters Thesis
    Full Text:
    suggestions. I would also like to thank my friends and colleagues, Ji Zheng, Hai Lan, Chi-Young Lim, Daniel

  • Analysis and modeling of microstrip on-chip interconnects on silicon substrate

    Creator:
    Lan, Hai
    Abstract:
    The electrical performance of on-chip interconnects has become a limiting factor to the performance of modern integrated circuits including RFICs, mixed-signal circuits, as well as high-speed VLSI circuits due to increasing operating frequencies, chip areas, and integration densities. It is advantageous to have fast and accurate closed-form expressions for the...
    Resource Type:
    Masters Thesis
    Full Text:
    graduate committee, reviewing the manuscript, and giving suggestions. Thanks to my colleagues, Ji Zheng

  • Field theoretic analysis of a class of planar microwave and opto-electronic structures

    Creator:
    Hahm, Yeon-Chang
    Abstract:
    With increasing operating frequencies in CMOS RF/microwave integrated circuits, the performance of on-chip interconnects is becoming significantly affected by the lossy substrate. It is the purpose of the first part of this thesis to develop a rigorous field theoretic analysis approach for efficient characterization of single and multiple coupled interconnects...
    Resource Type:
    Dissertation
    Full Text:
    and advice. Also, special thanks are given to J. Zheng, C. Lim, K. Remley, A. Tripathi, R. Lutz, and

  • Inductors in high-performance silicon radio frequency integrated circuits : analysis, modeling, and design considerations

    Creator:
    Lutz, Richard D., Jr
    Abstract:
    Spiral inductors are a key component of mixed-signal and analog integrated circuits (IC's). Such circuits are often fabricated using silicon-based technology, owing to the inherent low-cost and high volume production aspects. However, semiconducting substrate materials such as silicon can have adverse effects on spiral inductor performance due to the lossy...
    Resource Type:
    Dissertation
    Full Text:
    of a conductor Si M() .x! Lit) R(f) R(f) L(f) Cox Cm Cox Gs, CsG p-Cs 19 FIGURE 2.8

  • Design of Compact Passive Components and Circuits for RF and Millimeter-Wave Integrated Circuit in Silicon

    Creator:
    Dong, Xuanyi
    Abstract:
    Emerging fifth generation (5G) and beyond 5G communication networks are stimulating the design of radio-frequency (RF) and millimeter-wave (mmWave) integrated circuits for wireless transceivers systems. While co-integration of active circuits and diverse passive components becomes feasible at these high operating frequencies, circuit design is faced with significant challenges due to...
    Resource Type:
    Dissertation
    Full Text:
    important projects. I want to thank my former colleague Lei Zheng for valuable discussions and sugges

  • Modelling of on-chip spiral inductors for silicon RFICs

    Creator:
    Melendy, Daniel
    Abstract:
    In high-frequency circuit design, performance is often limited by the quality of the passive components available for a particular process. Specifically, spiral inductors can be a major bottle-neck for Voltage-Controlled Oscillators (VCOs), Low-Noise Amplifiers (LNAs), mixers, etc. For designers to correctly optimize a circuit using a spiral inductor, several frequency-domain...
    Resource Type:
    Masters Thesis
    Full Text:
    suggestions. Thanks to my colleagues, Amy Luoh, Hai Lan, and Ji Zheng, for their encour- agement, useful

  • Analysis and modeling of monolithic on-chip transformers on silicon substrates

    Creator:
    Mayevskiy, Yevgeniy
    Abstract:
    Passive components, including spiral inductors and transformers, fabricated on silicon-based substrates are placing an increasing demand on radio-frequency integrated circuit (RFIC) design. Performance of the RFIC suffers from several non-ideal effects that must be taken into account in order to create a successful design. In particular, monolithic transformers can be...
    Resource Type:
    Masters Thesis
    Full Text:
    capacitor ( C0 x) in series with a parallel combination of substrate resistor (Rsub) and capacitor (Csub

  • Broadband modeling of on-chip transformers for silicon RFICs

    Creator:
    Rapolu, Kavitha
    Abstract:
    Magnetically coupled passive transformers are increasingly integrated on-chip for various analog and radio frequency (RF) applications including direct current (DC) isolation, impedance transformation/matching, and conversion between single-ended and differential signals. A primary motivation for the on-chip integration of transformers is the overall size reduction and reduced cost. However, the performance...
    Resource Type:
    Masters Thesis
    Full Text:
    A ∈ CN×N is a matrix (MNA stamp) which contains the known circuit elements, x∈ CN×1 contains the

  • Enabling metal-fill-aware design of integrated circuits

    Creator:
    Shilimkar, Vikas S.
    Abstract:
    In advanced integrated circuit (IC) processes, the metal fill inserted to meet foundry imposed density requirements degrades the performance of interconnects and passive components which ultimately affects the overall circuit performance. Accounting for this degradation through electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However,...
    Resource Type:
    Dissertation
    Full Text:
    loss calculations code. I want to thank lab mates Lei Zheng and Dyuti Sengupta, and classmates Ram