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Filtering by: Creator Taylor, Kendrick C. Remove constraint Creator: Taylor, Kendrick C. Creator Austin, Dustin Z. Remove constraint Creator: Austin, Dustin Z. Degree Field Electrical and Computer Engineering Remove constraint Degree Field: Electrical and Computer Engineering

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  • Atomic Layer Deposition of Multi-Insulator Metal-Insulator-Metal Capacitors

    Creator:
    Austin, Dustin Z.
    Abstract:
    Back end of line (BEOL) metal-insulator-metal capacitors (MIMCAPs) have become a core passive component in modern integrated circuits. International Technology Roadmap for Semiconductors (ITRS) projections for scaling of analog/mixed-signal MIMCAP applications require simultaneously increasing capacitance density while maintaining low leakage current density and low voltage nonlinearity (characterized by the quadratic...
    Resource Type:
    Dissertation
    Full Text:
    performance requirements, BEOL processing allows for temperatures of no more than 400°C. In