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Filtering by: Subject Electric rheostats -- Design and construction Remove constraint Subject: Electric rheostats -- Design and construction Creator Shilimkar, Vikas S. Remove constraint Creator: Shilimkar, Vikas S.

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  • Enabling metal-fill-aware design of integrated circuits

    Creator:
    Shilimkar, Vikas S.
    Abstract:
    In advanced integrated circuit (IC) processes, the metal fill inserted to meet foundry imposed density requirements degrades the performance of interconnects and passive components which ultimately affects the overall circuit performance. Accounting for this degradation through electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However,...
    Resource Type:
    Dissertation
    Full Text:
    electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However

  • Metal fill considerations for on-chip interconnects and spiral inductors

    Creator:
    Shilimkar, Vikas S.
    Abstract:
    Variability in circuit performance due to process defects is a major concern in integrated circuit (IC) fabrication. Advanced IC manufacturing processes employ Chemical-Mechanical Polishing (CMP) for planarization of oxide and metal layers. CMP defects result in variations in the oxide and metal topographical profile. To reduce these topographical variations, electrically...
    Resource Type:
    Masters Thesis
    Full Text:
    Design Parameters . . . . . . . . . . . . . . . . . . 70 4.4 Separation of Electric and Magnetic Impact