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Filtering by: Creator Melendy, Daniel Decade 2010-2019 Rights Statement In Copyright

Modeling and Design of Interconnects and Passive Components for Millimeter-Wave Integrated Circuits in Silicon

Creator:

Zheng, Lei

Abstract:

For mmWave Integrated Circuit (IC) design, co-integration of passives can reduce size and power consumption, increase reliability, and reduce overall cost. However, skin and proximity effects in the metallization are aggravated at mmWave frequencies, resulting in increased attenuation and degradation of overall performance. Furthermore, tight integration of passive components (to...

Resource Type:

Dissertation
Equivalent circuit modeling of on-chip magnetic devices based on terminal measurements

Creator:

Gaskill, Steven G.

Abstract:

The addition of thin-film alloy magnetic materials to integrated circuit processing enables a number of novel monolithic circuits. Examples include fully integrated magnetic field sensors, signal and power galvanic isolation circuits, and power supplies on chip (PwrSoC). There are several benefits to integrating these traditionally off-chip devices, including improved manufacturability,...

Resource Type:

Dissertation
Enabling metal-fill-aware design of integrated circuits

Creator:

Shilimkar, Vikas S.

Abstract:

In advanced integrated circuit (IC) processes, the metal fill inserted to meet foundry imposed density requirements degrades the performance of interconnects and passive components which ultimately affects the overall circuit performance. Accounting for this degradation through electromagnetic and equivalent circuit modeling is becoming a critical aspect of IC design. However,...

Resource Type:

Dissertation