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Filtering by: Creator Brant, Justin B. Degree Field Chemical Engineering

Impurity effect on magnetism of nickel for under bump metallization via magnetron sputtering

Creator:

Ong, Justin B.

Abstract:

Nickel or nickel alloys are common materials used in under bump metallization (UBM) in flip chip technology. Nickel is used because of its slow reaction rate with tin-based solder at elevated temperatures. However, nickel is ferromagnetic at room temperature, hence cannot be easily deposited with magnetron sputtering. In this study,...

Resource Type:

Masters Thesis

Full Text:

AN ABSTRACT OF THE THESIS OF Justin B. Ong for the