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Filtering by: Committee Member Swanson, David K. Remove constraint Committee Member: Swanson, David K. Degree Field Materials Science Remove constraint Degree Field: Materials Science

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  • Time-Dependent Crack Growth Mechanisms in Alloy 617 at 800°C in Air

    Creator:
    Addison, Dylan, A.
    Abstract:
    Time-dependent crack growth mechanisms in Alloy 617 at 800°C in air were studied using compact tension samples machined in the L-T direction, cracked at temperature using an induction furnace and servo-hydraulic load frame. The application of different loading waveforms, including triangular, hold time, and sustained loading, were studied with relation...
    Resource Type:
    Masters Thesis
    Full Text:
    . .......................................................................... 28 Figure 23. Fracture surface comparison of samples 617-20G and 617-23G with ∆K levels

  • Chemical Solution Deposition and Advanced Characterization of Pb-free, Bi-based, Piezoelectric Thin Films

    Creator:
    Mason, Ashley D.
    Abstract:
    Piezoelectric materials convert mechanical strain into a dielectric displacement, as well as the converse, allowing these materials to be used as sensors, actuators, and transducers. Currently, lead zirconate titanate (PZT) is the primary material used in these applications. Due to environmental toxicity and safety concerns associated with Pb, development of...
    Resource Type:
    Dissertation
    Full Text:
    in a single layer film, and (2) map the locations of Bi, Na, and K throughout the thin film, bottom

  • Fatigue reliability predictions in silicon nitride ceramics based on fatigue behavior, bridging stresses and fracture data

    Creator:
    Greene, Rawley Brandon
    Abstract:
    Because of its attractive material properties like high hardness, high toughness, and excellent high temperature strength, materials like silicon nitride are becoming more common for use in high performance applications. However, there have been limited studies of the fatigue behavior of small cracks in silicon nitride and other materials toughened...
    Resource Type:
    Dissertation
    Full Text:
    C -1 and higher thermal conductivity than other ceramics of 30 W/m-K. 6 It also exhibits