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Filtering by: Creator Deng, Roy Degree Name Master of Science (M.S.) Subject Interconnects (Integrated circuit technology) -- Design and construction

Metal fill considerations for on-chip interconnects and spiral inductors

Creator:

Shilimkar, Vikas S.

Abstract:

Variability in circuit performance due to process defects is a major concern in integrated circuit (IC) fabrication. Advanced IC manufacturing processes employ Chemical-Mechanical Polishing (CMP) for planarization of oxide and metal layers. CMP defects result in variations in the oxide and metal topographical profile. To reduce these topographical variations, electrically...

Resource Type:

Masters Thesis
Analysis and modeling of multi-mode effects in coplanar waveguide bends

Creator:

Senguttuvan, Rajarajan

Abstract:

A novel method for modeling bends in coplanar waveguides (CPWs) is described. The CPW can be viewed as a pair of parallel coupled quasi-slot lines. Bends in the CPW are modeled as a non-uniform coupled line system in terms of their even- and odd- mode characteristics. This modeling approach is...

Resource Type:

Masters Thesis